Samsung's Chinese wafer fab gets OK
LONDON – Samsung Electronics Co. Ltd. has received permission from the South Korean Ministry of Knowledge and Economy to build a NAND flash memory wafer fab in China with the proviso that the ministry provides security support to prevent technology leaks, according to reports referencing the ministry as their source.
It emerged late in 2011 that Samsung was seeking permission to spend about $4 billion on a NAND flash memory wafer fab in China and get it up and running in second half of 2013. The plan calls for the fab to begin production on a 20-nm class process. The location of the wafer fab has not yet been decided, according to a report in EETimes. >>More here
SOURCE: eetimes.com
RELATED STORIES
>> Hot Topics
>> Innovation Destinations
>> Investment Watch
>>NewsMap
>> Latest News